Title:
PRINTED CIRCUIT BOARD AND ITS CONNECTION
Document Type and Number:
Japanese Patent JP2878066
Kind Code:
B2
Abstract:
PURPOSE: To provide a connecting method of printed circuit boards that is effective with connection of narrow printed circuit boards by forming a cutting off region of a film part to expose soldering terminal parts of electrode to be vertical with the electrode parts.
CONSTITUTION: With narrow width TCP10, a cutting off region 14a to expose soldering terminals 13a... is formed with whole width in the direction vertical with the input electrodes 13... and the part, where the soldering parts 13... are formed, is formed with only the input electrode 13... and without the film part 14. Therefore the bending flexibility of the forming parts of the soldering terminal 13... of the narrow width TCP10 is improved and when input terminals 13... of the narrow width TCP10 and wiring board electrodes of a printed wiring board are soldered, the film 14 of input electrode end is adhered easily with the printed wiring board helped by the cutting off region 14a. With this the reliability of the connection is improved.
Inventors:
TAGUCHI TOSHIMICHI
Application Number:
JP12169793A
Publication Date:
April 05, 1999
Filing Date:
May 24, 1993
Export Citation:
Assignee:
SHAAPU KK
International Classes:
H01L21/60; H01L23/31; H01L23/495; H05K1/18; H05K3/36; A61B17/00; A61B17/072; A61B17/32; H05K3/30; (IPC1-7): H01L21/60; H05K1/18
Domestic Patent References:
| JP4348049A | ||||
| JP1251079A | ||||
| JP5183014A | ||||
| JP42029U | ||||
| JP63162464U | ||||
| JP494770U |
Attorney, Agent or Firm:
Kenzo Hara
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