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Title:
PRINTED-CIRCUIT BOARD AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JPH04283982
Kind Code:
A
Abstract:

PURPOSE: To achieve connection from either direction of front and rear of a substrate component by placing one portion of a pattern sheet at the other surface side of the substrate component through the substrate component body.

CONSTITUTION: In a printed-circuit component 10, a pattern sheet 20 where a circuit pattern 21 consisting of a conductor such as copper or a conductive paste is formed at a flexible sheet 22 at a side of an inner surface 12 of a substrate component body 11 with a section in U-shape consisting of a general- purpose resin is joined in one piece. An edge portion 24 of the pattern sheet 20 is provided at a side of an outer surface 17 of the substrate component 11 through the substrate component body 11. The edge portion 24 through the substrate component body 11 is formed by a free edge which is not joined to the substrate component body 11 and is directly connected to an external circuit and a device with a connector 15. Also, by forming a plurality of routing wires at the pattern sheet, a circuit pattern can also be provided on the front and rear of the substrate body alternately.


Inventors:
OMORI KAZUMITSU
Application Number:
JP7405491A
Publication Date:
October 08, 1992
Filing Date:
March 12, 1991
Export Citation:
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Assignee:
MEIKI SEISAKUSHO KK
International Classes:
H05K1/02; H05K3/00; H05K1/00; H05K1/11; (IPC1-7): H05K1/02; H05K3/00
Domestic Patent References:
JPS63200592A1988-08-18
Attorney, Agent or Firm:
Noriaki Goto