Title:
PRINTED CIRCUIT BOARD AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JPH04342188
Kind Code:
A
Abstract:
PURPOSE: To enhance reliability of a dry film to be formed on a through hole.
CONSTITUTION: A through hole 4 is filled with a copper paste as a filler 5 by a screen printing method, thereafter a second plated layer 6 is formed to form a dry film layer, printing and developing are performed and the dry film is removed to manufacture a printed circuit board 10.
Inventors:
OIKAWA SHOJI
SUZUKI HARUO
ISHIKAWA KAZUMITSU
SUZUKI HARUO
ISHIKAWA KAZUMITSU
Application Number:
JP14061591A
Publication Date:
November 27, 1992
Filing Date:
May 17, 1991
Export Citation:
Assignee:
HITACHI AIC INC
International Classes:
H05K3/06; H05K3/42; (IPC1-7): H05K3/06; H05K3/42