Title:
PRINTED CIRCUIT BOARD MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JPH09232744
Kind Code:
A
Abstract:
To provide a printed circuit board manufacturing method superior in mass productivity by improving the soldering work efficiency.
Electronic elements 1 housed in a housing 9 are coated with a resin material 10 having an ultraviolet hardening-thermosetting combined solder resist property and the resin material is hardened. The material 10 deposited on at least land-connecting faces of the terminals 3 of each element 10 is cleaned.
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| JPS59193055 | THYRISTOR MOUNTING BOARD |
Inventors:
MATSUDA YOSHINARI
MORITA KOJI
SASAME KIYOSHI
MORITA KOJI
SASAME KIYOSHI
Application Number:
JP4113996A
Publication Date:
September 05, 1997
Filing Date:
February 28, 1996
Export Citation:
Assignee:
SONY CORP
TOKYO PROCESS SERVICE
TOKYO PROCESS SERVICE
International Classes:
H05K3/34; H05K3/00; H05K3/28; (IPC1-7): H05K3/34; H05K3/34
Attorney, Agent or Firm:
Akira Koike (2 outside)