PRINTED CIRCUIT AND BOARD MATERIAL WITH LOW Z-AXIS THERMAL EXPANSION

Title:

PRINTED CIRCUIT AND BOARD MATERIAL WITH LOW Z-AXIS THERMAL EXPANSION

Document Type and Number:

Japanese Patent JP3251949

Kind Code:

B2

Abstract:

PURPOSE: To obtain the resisting property for the breakage caused by thermal stress and heat circulation on a board material by a method wherein the board material is formed in multilayer by a woven cloth which is impregnated by thermoplastic polymerized resin varnish having specific characteristics, and one or more layers of internally conductive pattern is provided.
CONSTITUTION: A board material is formed by a piece of multilayered cloth on which thermosetting polymerized resin varnish is impregnated, and an inner conductive pattern layer in one or more layers is provided. The varnish contains fillers. Also, a threshold value with time weight of eight hours for the human exposure, which is larger than 1 mg/m3, is set. Besides, Mohs hardness of the board material is set at 7 or smaller, the substrate material is not decomposed at the temperature of 300°C or lower and the water contained therein is not discharged, and the material has non-moisture absorbing property. The quantity sufficient to give an average thermal expansion coefficient in Z-axis direction, which is equal to the value obtained by adding the maximum elongation percentage of copper at 270°C which is suitable in formation of conductive pattern on the wall of hole of a printed wiring board, is compounded.

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Inventors:

Thomas S Comb

Application Number:

JP13789591A

Publication Date:

January 28, 2002

Filing Date:

June 10, 1991

Export Citation:

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