To provide a printed circuit board which can be discriminated easily from a printed circuit board using lead solder, to provide a method of manufacturing the same, and to provide a method of identifying the same.

A heat sensitive material 3 is fixed to the surface of a printed circuit board 1 or the surface of a component 2 mounted on the printed circuit board 1. Soldering is performed after the heat sensitive material 3 is fixed to the surface of the printed circuit board 1 or the surface of the component 2 mounted on the printed circuit board 1. Furthermore, the problem is overcome by performing soldering after the heat sensitive material 3 is fixed to the surface of the printed circuit board 1 or the surface of the component 2 mounted on the printed circuit board 1.