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Title:
PRINTED-CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2017011189
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a printed-circuit board including a waveguide which does not need a conductor layer (waveguide component) surrounding a dielectric body in a mechanistically case shape and is improved in characteristics of signals passing through the waveguide.SOLUTION: A printed-circuit board includes: an insulation member 1 obtained by impregnating resin into an insulating cloth material 2: a resin 4 filled into an opening 3 formed by removing a part of this insulation member 1; and a conductor 5 serving as a waveguide 10 formed on the filled resin 4. The resin 4 filled into the opening 3 is different in a dielectric constant or dielectric loss tangent of the resin impregnated into the insulation member 1. The conductor 5 is formed on the vertical surface of the filled resin 4, the width of the conductor 5 is a multiple of integer of λ/4 of signal wave length (λ) to be transmitted, and the length of the conductor 5 is a multiple of integer of λ/4 of the signal wave length (λ).SELECTED DRAWING: Figure 1

Inventors:
TAIRA KAZUYA
NAITO MASANORI
KANEKO TOSHIYUKI
Application Number:
JP2015127026A
Publication Date:
January 12, 2017
Filing Date:
June 24, 2015
Export Citation:
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Assignee:
KYOCERA CORP
International Classes:
H05K1/02; H01P3/12; H01P5/107; H01P11/00
Attorney, Agent or Firm:
Toshikazu Fukai
Yosuke Tsushima
Waseda Shigeyuki