Title:
プリント基板加工機
Document Type and Number:
Japanese Patent JP5138273
Kind Code:
B2
Abstract:
A printed circuit board machining apparatus includes a spindle that holds a tool for machining a printed circuit board and a pressure unit for pressing the printed circuit board to a table in machining the printed circuit board. The pressure unit includes a pressure foot movable up an down along the spindle, a rotating member having a plurality of pressure pieces through which a through hole for passing the tool is formed and provided so as to select one among the plurality of pressure pieces, a motor for moving the rotating member, cylinders and electromagnetic valves for moving the pressure foot up and down and a control section for controlling the cylinders and electromagnetic valves. The control section rotates the motor so as to select the pressure piece and controls the cylinders and the electromagnetic valves to change force for pressing the printed circuit board.
Inventors:
Hirofumi Kado
Hiroyuki Kamata
Shintaro Takahashi
Katsuhiro Nagasawa
Hiroyuki Kamata
Shintaro Takahashi
Katsuhiro Nagasawa
Application Number:
JP2007138281A
Publication Date:
February 06, 2013
Filing Date:
May 24, 2007
Export Citation:
Assignee:
Hitachi Via Mechanics, Ltd.
International Classes:
B23B47/28; B23B41/00; B23C3/00; B26F1/16
Domestic Patent References:
| JP10337697A | ||||
| JP4041112A | ||||
| JP2002144292A |
Attorney, Agent or Firm:
Kazuo Chikajima