PURPOSE: To prevent damage on wiring and electrode at the time of installing a sealer by positioning a sealer through preceding formation of elevated insulator on a printed circuit board.

CONSTITUTION: An elevated part 4 of insulating macromolecule or glass is formed by a thick film printing technique on a ceramic thick film printed circuit board 1. An IC chip 2 is directly bonded to the substrate 1 and the substrate electrode 5 and chip electrode 6 are wired. A ceramic 3 is positioned by elevated part 4, the lower surface of sealer is bonded 8 to the substrate 1 and N2 is sealed into the sealer. A part of sealer is bonded to a printed wiring 9. The internal surface 10 of elevated part 4 guides the external surface of lower end of sealer 3 for the positioning. Height and width of elevated part are selected in accordance with dimensions of sealer and substrate 1. Thus, an IC chip is directly mounted on a thick film printed circuit board and a cap type sealer is placed thereon. Thereby, simplified sealing can be realized without damage on wiring and electrode.