Title:
PRINTED CIRCUIT BOARD
Document Type and Number:
Japanese Patent JP3878527
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a novel printed circuit board which is formed by adhering a metallic plate firmly with higher thermal conductivity and enables the metallic plate to fully exert its function as a heat sink and a reinforcing plate.
SOLUTION: A metallic plate 3 is adhered to the rear of a chip mounting part 2 of a substrate 1 having the bump-method chip mounting part 2 consisting of a number of conductor circuits 21 in the surface of the substrate 1 via an adhesive layer 4 containing chain-like metallic powder.
Inventors:
Yoshio Oka
Masahiko Kanda
Hayashi Kenki
Kimura Toshihide
Shuji Kashiwagi
Akira Nishimura
Masahiko Kanda
Hayashi Kenki
Kimura Toshihide
Shuji Kashiwagi
Akira Nishimura
Application Number:
JP2002239648A
Publication Date:
February 07, 2007
Filing Date:
August 20, 2002
Export Citation:
Assignee:
Sumitomo Electric Print Circuit Co., Ltd.
International Classes:
C09J9/02; H05K1/02; C09J201/00; H01L21/60; H01L23/12; H05K7/20; (IPC1-7): H05K1/02; H01L21/60; H01L23/12; H05K7/20; //C09J9/02; C09J201/00
Domestic Patent References:
| JP10335866A | ||||
| JP11145627A | ||||
| JP55078070A | ||||
| JP2001107104A |
Attorney, Agent or Firm:
Inaoka cultivation
Mio Kawasaki
Mio Kawasaki