Title:
プリント回路基板（ＰＲＩＮＴＥＤ ＣＩＲＣＵＩＴ ＢＯＡＲＤ）
Document Type and Number:
Japanese Patent JP7286899
Kind Code:
B2
Abstract:
A printed circuit board according to an aspect of the present invention includes: a laminate in which a plurality of insulating layers including a rigid insulating layer are stacked up and down; a flexible insulation layer of which some areas are in vertical contact with at least one of the plurality of insulating layers, and remaining areas are located outside the laminate; a device mounting area formed on one surface of the flexible insulating layer; and a first reinforcing member formed on the other surface of the flexible insulating layer to correspond to the device mounting area.
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Inventors:
Ham, Ho-Hyun
Lee, Sayon
Lee, Sayon
Application Number:
JP2019072745A
Publication Date:
June 06, 2023
Filing Date:
April 05, 2019
Export Citation:
Assignee:
Samsung Electro-Mechanics Company Limited.
International Classes:
H05K3/46; H05K1/02
Domestic Patent References:
| JP2003249758A | ||||
| JP2005303172A | ||||
| JP2007073738A | ||||
| JP2006019336A | ||||
| JP2006303163A | ||||
| JP2003332743A | ||||
| JP2000077797A | ||||
| JP2005045150A |
Attorney, Agent or Firm:
Patent Attorney Corporation RYUKA International Patent Office