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Patent Searching and Data


Title:
PRINTED CIRCUIT BOARD
Document Type and Number:
Japanese Patent JPH03234087
Kind Code:
A
Abstract:

PURPOSE: To improve the strength of an inner layer material and to improve dimensional stability by arranging an outer layer material on the outermost layer through a predetermined number of inner layer material surface prepreg layers formed with a circuit on one or both side surface metal-plated laminated board made of triangular woven cloth as its base material.

CONSTITUTION: A laminate in which copper foils are arranged on upper and lower surfaces of seven laminated resin-impregnated cloths obtained by impregnating triangular woven glass fabric with a predetermined amount of epoxy resin containing curing agent and drying it, is laminated under predetermined pressure at a predetermined temperature as a both-side copper-plated laminated board. Electric circuits are formed on both side surfaces of the laminate as inner layer materials. Then, a laminate in which copper foils are arranged on the outermost layers of the upper and lower surfaces of the inner layer material through two epoxy resin-impregnated glass cloth prepregs of predetermined resin amount, is laminated under predetermined pressure at a predetermined temperature as a 4-layer circuit printed board. Thus, its strength, dimensional stability can be improved.


Inventors:
ARAI TAKAFUMI
Application Number:
JP3096290A
Publication Date:
October 18, 1991
Filing Date:
February 09, 1990
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
D03D1/00; D03D25/00; H05K1/02; H05K3/46; H05K1/00; H05K1/03; (IPC1-7): D03D1/00; D03D25/00; H05K1/02; H05K3/46
Attorney, Agent or Firm:
Shigeji Sato (1 person outside)