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Title:
PRINTED CIRCUIT BOARD
Document Type and Number:
Japanese Patent JPH07235759
Kind Code:
A
Abstract:

PURPOSE: To make it possible to meet the compactification needs by suppressing the occurrence of land cut on a printed circuit board, performing good electrical connections with electronic parts and improving the yield of production.

CONSTITUTION: Slit-like nicks are made from the rear surface to the principal surface on which the wiring pattern is formed on the land portion on a printed circuit board for inserting the terminals of electronic parts. The land portion can be a circular land portion 3a, and the nicks may be provided in radial direction of the land portion 3a. Also, the nicks 4a and 4b can be located at two places perpendicular to each other.


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Inventors:
CHISAKA TAKATOSHI
KIKUCHI KAZUYUKI
AIZAWA MASANORI
Application Number:
JP2811494A
Publication Date:
September 05, 1995
Filing Date:
February 25, 1994
Export Citation:
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Assignee:
SONY CORP
International Classes:
H05K3/34; H05K1/02; H05K3/40; (IPC1-7): H05K3/34; H05K1/02
Attorney, Agent or Firm:
Akira Koike (2 outside)



 
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