Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
PRINTED-CIRCUIT BOARD
Document Type and Number:
Japanese Patent JPS6473697
Kind Code:
A
Abstract:

PURPOSE: To make it possible to give a resin-based thick film conductor by a method wherein a shape of an electrode to be connected electrically to the resin-based thick-film conductor is made to be a specific linear shape and the resin-based thick-film conductor is formed in such a way that this conductor covers the linear electrode part or that it comes into contact with one side of the linear electrode part.

CONSTITUTION: When a shape of an electrode where a crack is to be caused most is formed to be linear with a width of 0.01mm∼0.3mm, a part which covers a difference in a radius of curvature at a bending operation due to a difference in a thickness between an electrode part 1 and a resin-based thick- fill conductive part 1 and due to a difference in a material is reduced, and the radius of curvature is determined only by a substrate. In this case, the substrate with a sheet thickness of 0.05mm∼0.3mm is a substrate which can be bent easily. When this substrate is used, the difference in the radius of curvature during the bending operation is hardly caused. As a result, an inflection point of the radius of curvature during the bending operation is eliminated; a point where a stress is concentrated is eliminated whereby it is possible to prevent a crack from being caused.


Inventors:
MIYAGAWA NOBORU
KONDO MITSUHIRO
Application Number:
JP23083287A
Publication Date:
March 17, 1989
Filing Date:
September 14, 1987
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
IBIDEN CO LTD
International Classes:
H05K1/11; H05K1/09; (IPC1-7): H05K1/11
Attorney, Agent or Firm:
Hironori Takenori