PURPOSE: To suppress the abnormal piling of solder in a conductive land pattern for the soldering connection of a component by a method wherein soldering patterns are provided so as to be connected to the conductive land pattern.

CONSTITUTION: Soldering patterns 27 and 29 are connected to both the sides of a conductive land pattern 13 through narrow connection patterns 23 and 25 respectively. The terminals 19 and 21 of a chip component 17 are placed on respective land patterns 13 and 15 and a solder reflow treatment is performed. At that time, solder forming a solder bridge may be moved to the conductive land pattern 13 but a parts of the solder are moved into the soldering patterns 27 and 29 through the respective conductive connection patterns 23 and 25. With this constitution, the abnormal piling of a solder filet in the conductive land pattern 13 can be suppressed.