To provide a printed wiring board which enables high density interconnection, an electronic apparatus having the printed wiring board, and a manufacturing method by which the high density printed wiring board with the high efficiency.

Conductor patterns 21a and 21b, composed of metal foils are formed on both the surfaces of an insulating substrate 26 of a printed wiring board. The parts of the metal foil of one of the conductor patterns 21a and 21b are pushed toward the other conductor pattern through the insulating substrate to form hollow protrusions 30, whose crest parts have a continuity with the other conductor pattern. In order to manufacture the printed wiring board, after an insulating layer has been formed on the metal foil, in which the hollow protrusions are formed by a press so as to cover the protrusions, the other metal layer is formed on the insulating layer, so as to have a continuity with the crest parts of the protrusions and, finally, the metal layers are patterned to form conductor patterns.