PRINTED WIRING BOARD AND ELECTRONIC DEVICE

Japanese Patent JP3765210

B2

PROBLEM TO BE SOLVED: To provide a printed wiring board which can be improved in both thermal shock resisting characteristic and drop impact resisting characteristic.
SOLUTION: In a printed wiring board, at least one of a solder resist layer 13, first resist layer L1R, first insulating layer L1i, solder resist layer 17, sixth resist layer L6R, and sixth insulating layer L6i is formed by using a resin material, having a tensile breaking strain of 1% or higher at a strain rate of 40%/sec at 25°C and Izod impact strength of 1.0 kgf.cm/cm or higher at 25°C. Alternatively, a material containing a resin material having 0.05 or higher peak dynamic loss tangent value caused at a temperature between -100°C and -50°C by β-relaxation in dynamic viscoelasticity measurement and 0.02 or higher peak dynamic loss tangent value caused at a temperature between 0°C and 100°C by β'-relxation in a similar measurement at a rate of 80 wt.% or higher, preferably, 90 wt.% or higher is used.

WO/2001/056340	SUBSTRATE MATERIAL PIECE, FLEXIBLE CIRCUIT BOARD, AND METHOD OF MANUFACTURING THE FLEXIBLE CIRCUIT BOARD
JPS60130114	METHOD OF SEALING ELECTRONIC PART
JPH06120418	MANUFACTURE OF HYBRID INTEGRATED CIRCUIT

Aichi Gosho
Kaoru Nomoto
Masayuki Aoyama
Suzuki Tadao

JP26260599A

April 12, 2006

September 16, 1999

Click for automatic bibliography generation  

株式会社デンソー

H05K3/28; H05K3/46; (IPC1-7): H05K3/28; H05K3/46

JP297515A
JP5152698A
JP10120875A
JP641331A
JP3103845A
JP57153021A
JP5320481A
JP8153831A
JP9232703A
JP6338666A
JP7142830A

Hironobu Onda
Makoto Onda

Previous Patent: PRESSURE-SENSITIVE ADHESIVE SHEET AND PREPARATION OF PRESSURE-SENSITIVE ADHESIVE SHEET

Next Patent: STOCK FOR VAPOR DEPOSITION