Title:
PRINTED WIRING BOARD HAVING FINE VIA HOLES AND MANUFACTURING METHOD THEREOF
Document Type and Number:
Japanese Patent JP2015142061
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a printed wiring board and a manufacturing method thereof which can solve the following problems: the difficulty of achieving a smaller via hole diameter by a conformal method for a printed wiring board; and the difficulty of a smaller land diameter by a laser direct method.SOLUTION: A printed wiring board with via holes reduced in diameter is prepared by using, of a laminate board having a copper conductor of a thickness ton at least one surface, the copper conductor as a laser mask, and performing a laser drilling process by a conformal method to form non-through via holes in the laminate board. The printed wiring board is formed by the steps of: providing laser mask openings of an opening diameter φat positions corresponding to layout positions of the non-through via holes; making the opening diameter of the laser mask openings smaller (φ) by opening diameter adjustment plating of a thickness t; filling a protection resin in the laser mask openings; then, performing a thin-film-planarization process on the laser mask or a combination of the laser mask and a layer of the opening diameter adjustment plating; and thereafter, performing the laser drilling process.
Inventors:
ODA SATOSHI
NISHIMURA HIROSHI
NISHIMURA HIROSHI
Application Number:
JP2014015061A
Publication Date:
August 03, 2015
Filing Date:
January 30, 2014
Export Citation:
Assignee:
SHINKO SEISAKUSHO LTD
International Classes:
H05K3/42; H05K3/00
Attorney, Agent or Firm:
Yoshitaka Oshida