Title:
PRINTED WIRING BOARD FOR IC CARD
Document Type and Number:
Japanese Patent JPH01119086
Kind Code:
A
Abstract:
PURPOSE:To sharply reduce any trouble such as a crack produced in a semiconductor or a broken thin wire by surrounding the semiconductor and the fine wire connecting a printed wiring board for an IC card and the semiconductor, with a metal frame of higher rigidity than that of a base material, the frame being difficult to be fixed. CONSTITUTION:The title board comprises titanium and alloys of the same, including stainless and aluminum and alloys of the same. A metal frame 13 is connected to the printed wiring board base material for an IC card. The base material includes polyester resin, polypropylene resin, polyethylene resin, polystylene resin, polyvinylidene chloride resin, ABC resin, and composite resin of the formers. The base material us coated with a copper foil on both surfaces, or with the same but on one surface, and with an adhesive on one surface. Further, the thickness of the resin base material is increased at a part thereof outside the metal frame where bend stress is absorbed, whereby the bend stress is more effectively absorbed as the thickness being more similar with the card thickness, to further reduce bend stress applied on the semiconductor and the thin wire.
Inventors:
HIROI ATSUSHI
HORIBA YASUHIRO
HORIBA YASUHIRO
Application Number:
JP27676887A
Publication Date:
May 11, 1989
Filing Date:
October 30, 1987
Export Citation:
Assignee:
IBIDEN CO LTD
International Classes:
H05K1/02; (IPC1-7): H05K1/02
Domestic Patent References:
| JP62084954B | ||||
| JP49137060B | ||||
| JPS5020167B1 | 1975-07-12 | |||
| JP54146858B |
Attorney, Agent or Firm:
Hironori Takenori