PURPOSE: To provide a printed wiring board intermediate body which can improve accuracy of a resistance value of a thin film resistance and can form both a thin film resistance and a thin film capacitor by the same pattern and also to provide a printed wiring board manufactured by using the intermediate body and a manufacture method thereof.

CONSTITUTION: Both a thin film resistance and a thin film capacitor can be formed of a wiring pattern used when a wiring 12 is formed by etching a conductor layer of a printed wiring board intermediate body having the same pattern. In the case of a thin film capacitor, a dielectric layer 2 is used as a dielectric of a capacitor and a capacitor is constituted between the wiring 12 of a region corresponding to the dielectric layer 2 and a resistance layer 3 of the region. In the case of a thin film resistance, a resistance layer of a region corresponding to the dielectric layer 2 is used as a resistor and a thin film resistance is constituted between wirings formed at both ends of the resistor.