Title:
PRINTED WIRING BOARD AND MANUFACTURING METHOD THEREOF
Document Type and Number:
Japanese Patent JP2022070723
Kind Code:
A
Abstract:
To provide a printed wiring board including, in the same hardened layer, a via hole with an opening diameter of 50 μm or more, which can be formed efficiently by sandblasting and a via hole with an opening diameter of 32 μm or less, which can be formed by laser processing.SOLUTION: A printed wiring board includes a hardened layer formed by thermosetting a resin composition containing a thermosetting resin. The hardened layer includes: a first via hole which has a first opening with an opening diameter of 50 μm or more on one surface of the hardened layer and which is formed to penetrate through the hardened layer from the first opening; and a second via hole which has a second opening with an opening diameter of 32 μm or less on the surface and which is formed to penetrate through the hardened layer from the second opening. The hardened layer has a thickness of 25 μm or less and an elastic modulus at 25°C of 5 GPa or more and 15 GPa or less.SELECTED DRAWING: Figure 13
Inventors:
WATANABE MASATOSHI
Application Number:
JP2020179948A
Publication Date:
May 13, 2022
Filing Date:
October 27, 2020
Export Citation:
Assignee:
AJINOMOTO KK
International Classes:
H05K3/46; H05K3/40; H05K3/42
Attorney, Agent or Firm:
Sakai International Patent Office