PURPOSE: To provide a printed wiring board and its manufacturing method which permits a pattern density of wiring patterns to be increased and also a degree of design freedom to be improved.

CONSTITUTION: A printed wiring board includes a dielectric substrate 9, a front surface pattern 51 formed on a front surface 91 of the substrate 9 and a rear surface pattern 52 formed on a rear surface 92 of the same. The front pattern 51 and the rear pattern 52 are interconnected to each other by means of a planar side pattern 50 formed on a side surface 90 of the substrate 9. In the formation of a wiring pattern of a printed wiring board 99, the formation of a photosensitive resin coating film including a side pattern 50 by an electrodeposition coating technique and exposure processing are employed.