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Title:
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2011124555
Kind Code:
A
Abstract:

To provide a printed wiring board which has a flat surface and is thin.

The printed wiring board 10 has an insulation layer 42 formed of an interlayer resin insulator forming an interlayer resin insulation layer of a build-up multilayer wiring board, and is thereby thin, so that heat from a mounted IC chip 60 can be efficiently dissipated. Conductor circuits 40A, 40B are buried in the insulation layer 42 on the side of a first surface 42U and positioned in level with the first surface of the insulation layer 42, which has no unevenness thereupon and is flat, so that the IC chip 60 can be mounted with high reliability.


Inventors:
KUNIEDA MASATOSHI
YOSHIKAWA KAZUHIRO
FURUSAWA TAKESHI
Application Number:
JP2010248324A
Publication Date:
June 23, 2011
Filing Date:
November 05, 2010
Export Citation:
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Assignee:
IBIDEN CO LTD
International Classes:
H05K3/20; H05K3/24
Domestic Patent References:
JP2001332654A2001-11-30
JP2006324542A2006-11-30
Foreign References:
WO2008001915A12008-01-03
Attorney, Agent or Firm:
Akito Tashita