Title:
PRINTED WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2016143725
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To prevent cracks from extending into a product area and a product from being failed when cut to a multiple piece printed wiring board from a panel which manufactures a plurality of printed wiring boards in bulk.SOLUTION: A multiple piece printed wiring board 100 includes: a product area 20 composed of a plurality of printed wiring boards 1a and 1b; and a dummy area 10 formed around one or two more product areas 20. On an outer peripheral end edge side of the dummy area 10, a plurality of independent dummy patterns 11 are formed, and a dummy post whose thickness is smaller than that of a conductive post is formed while being connected to the dummy pattern 11.SELECTED DRAWING: Figure 1A
Inventors:
SAKAI SHUNSUKE
FURUYA TOSHIKI
NAKAMURA WATARU
ADACHI TAKEMA
FURUYA TOSHIKI
NAKAMURA WATARU
ADACHI TAKEMA
Application Number:
JP2015017471A
Publication Date:
August 08, 2016
Filing Date:
January 30, 2015
Export Citation:
Assignee:
IBIDEN CO LTD
International Classes:
H05K1/02; H05K3/00
Domestic Patent References:
| JP2005183590A | 2005-07-07 | |||
| JP2006108211A | 2006-04-20 | |||
| JP2012060122A | 2012-03-22 | |||
| JP2012114183A | 2012-06-14 | |||
| JPH0851258A | 1996-02-20 | |||
| JP2007180211A | 2007-07-12 | |||
| JP2009289848A | 2009-12-10 |
Attorney, Agent or Firm:
Asahina Patent Office