Title:
PRINTED WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP3901430
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To propose a printed wiring board wherein fine letters can be formed, the number of manufacturing processes is reduced and manufacturing is enabled at a low cost, and to provide a method of manufacturing the printed wiring board.
SOLUTION: An ink layer 100 is formed on a solder resist layer 70 by using ink in which ink whose absorptance of light is high and ink whose absorptance of light is low are mixed, and trenches 110 having fine letter shapes are formed on the ink layer 100 by using a laser. As a result, image recognition of letters for process recognition can be accurately performed, and the printed wiring board 10 wherein the number of manufacturing processes is reduced and manufacturing is enabled at a low cost can be obtained.
More Like This:
Inventors:
Toshihiko Yokomaku
Masaya Watanabe
Masaya Watanabe
Application Number:
JP2000181269A
Publication Date:
April 04, 2007
Filing Date:
June 16, 2000
Export Citation:
Assignee:
IBIDEN CO.,LTD.
International Classes:
B41J2/44; H05K1/02; B23K26/18; H05K3/00; B23K101/42; (IPC1-7): H05K1/02; B23K26/18; B41J2/44; H05K3/00; //B23K101:42
Domestic Patent References:
| JP4085893A | ||||
| JP4072666U | ||||
| JP4220181A | ||||
| JP2000158787A | ||||
| JP4282884A | ||||
| JP62203692A | ||||
| JP60204392A | ||||
| JP5013259A | ||||
| JP10240888A |
Attorney, Agent or Firm:
Akito Tashita