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Title:
PRINTED WIRING BOARD FOR MOUNTING SURFACE MOUNTING PARTS
Document Type and Number:
Japanese Patent JPH01119088
Kind Code:
A
Abstract:

PURPOSE: To recognize a position of an alignment mark with high accuracy without permitting random reflection of a detection light from a position recognition device, etc., by forming a dummy pattern, when a gold-plated layer is formed simultaneously, around the alignment mark upon forming the gold-plated layer as the outermost layer of the alignment mark.

CONSTITUTION: The outermost layer of an alignment layer comprises a gold- plated 16 layer, whereby upon rendering a pattern 14 as the alignment mark to nickel plating and gold plating, the nickel plating and the gold-plating are applied on the pattern 14 also serving as a dummy pattern 12. For this, the gold plating is applied over a wide area compared with a case where only the alignment mark is formed so that no abnormal separation occurs at the edge of the alignment mark. Thus, a surface of the alignment mark, on which a light is received, is smoothed away. Even if there occur any abnormal separation, it is produced on the dummy pattern 12 formed on the edge of the alignment mark 11. Accordingly, the light-receiving surface of the alignment mark 11 is flattened without protrusion of the edge of the alignment mark 11 owing to the abnormal separation.


Inventors:
KATO SHINICHI
NISHIDA TAKESHI
Application Number:
JP27629987A
Publication Date:
May 11, 1989
Filing Date:
October 31, 1987
Export Citation:
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Assignee:
IBIDEN CO LTD
International Classes:
H05K1/02; H05K13/04; H05K1/11; H05K3/24; (IPC1-7): H05K1/02; H05K13/04
Domestic Patent References:
JPS6076060U1985-05-28
JPS60161693A1985-08-23
Attorney, Agent or Firm:
Hironori Takenori