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Title:
PRINTED-WIRING BOARD AND PAPER-, PHENOL-AND COPPER-CLAD LAMINATED BOARD
Document Type and Number:
Japanese Patent JPH10275962
Kind Code:
A
Abstract:

To obtain a printed-wiring board in which whether a copper paste protrudes between copper-foil lands at a narrow land interval or not can be detected easily.

The color of a surface in a narrow part in which the interval size between adjacent copper-foil lands 3a, 3b on a paper-, phenol- and copper- clad laminated board 4 is narrow so as hot to be capable of forming a resist layer 8 is set as a color which can be discriminated clearly from the color of a hardened copper paste 7. Specifically, the color of an adhesive layer 6 by which a copper foil is bonded to a paper-based material 5 at the paper-, phenol- and copper-clad laminated board 4 is set as a color which is complementary to the color of the hardened copper paste 7 or a white color.


Inventors:
WAKABAYASHI AKINAO
IINO HIROSHI
IZUMI JUNICHI
Application Number:
JP7966397A
Publication Date:
October 13, 1998
Filing Date:
March 31, 1997
Export Citation:
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Assignee:
HOKURIKU ELECT IND
International Classes:
B32B7/02; B32B15/08; B32B15/20; B32B27/42; H05K1/02; H05K1/11; H05K3/00; H05K1/09; H05K3/40; (IPC1-7): H05K1/02; B32B7/02; B32B15/08; B32B15/20; B32B27/42; H05K1/11; H05K3/00
Attorney, Agent or Firm:
Hidetoshi Matsumoto (1 outside)