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Patent Searching and Data


Title:
PRINTED WIRING BOARD FOR SURFACE MOUNTING AND ITS MANUFACTURE
Document Type and Number:
Japanese Patent JPH04209592
Kind Code:
A
Abstract:

PURPOSE: To improve the adhesion of the cream solder by screen printing by protruding the surface of the conductor on which to print solder farther than the level of the surface of the printed wiring board.

CONSTITUTION: The surface 34 of the conductor of a foot print on which to print cream solder 5 is above the level of the surface 44 of the printed wiring 2 coated with solder resist 4. In this case, only the printed wiring 2 at the part to be coated with solder resist 4 after formation of the wiring pattern on the surface by etching is etched, and it is formed being lowered by the amount of the thickness above the thickness of the coating of the solder resist 4, and it is coated with solder resist 4. Hereby, gap does not occur between the mask and the surface 34 of the conductor of the foot print 3, and for the cream solder 5 pushed out by the mask, the top surely adheres to the surface of the foot print 3.


Inventors:
KIKUCHI HIROMI
Application Number:
JP40054490A
Publication Date:
July 30, 1992
Filing Date:
December 06, 1990
Export Citation:
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Assignee:
FUJITSU LTD
International Classes:
H05K3/28; (IPC1-7): H05K3/28
Attorney, Agent or Firm:
Sadaichi Igita