PURPOSE: To provide a printed wiring board with improved adhesion property of a resin-sealing layer even if it is preserved under high-temperature and high- humidity environment and its manufacturing method.

CONSTITUTION: The title printed wiring board is provided with a base circuit 1 consisting of copper formed on the surface of an insulation substrate 5, a header circuit 2 which is wider than the base circuit on the top surface of the base circuit 1, and a resin-sealing layer 4 for surrounding the base circuit 1 and the header circuit 2. After the header circuit 2 is formed on the copper foil surface where the insulation substrate 5 in that copper foil is provided on the surface is exposed, etching is performed on the copper foil surface where covered resist layer is eliminated, thus forming the base circuit 1 whose circuit width is narrower than that of the header circuit 2 and further the resin-sealing layer 4.