Title:
PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2010021302
Kind Code:
A
Abstract:
To provide a printed wiring board which has fine-wiring wirability and insulation reliability.
The printed wiring board includes wiring and an insulating material and has substantially no electroless plating catalyst between wiring lines of the printed wiring board, and is characterized in that the ratio X/Y of a wiring thickness X to an insulating layer thickness Y is 0.01 to 0.5.
Inventors:
SHIMOOSAKO KANJI
Application Number:
JP2008179688A
Publication Date:
January 28, 2010
Filing Date:
July 10, 2008
Export Citation:
Assignee:
KANEKA CORP
International Classes:
H05K1/02; H05K1/03; H05K3/10; H05K3/18