Title:
PRINTED-WIRING BOARD
Document Type and Number:
Japanese Patent JP2014160838
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a method for manufacturing a printed wiring board capable of preventing the printed wiring board from breaking even if a bend radius is small.SOLUTION: A method for manufacturing a printed wiring board 1 comprises: a first step S10 of forming a copper layer 23 of a wiring pattern 20 on a base film 10; a second step S20 of laminating a coverlay 30 on the base film 10 and covering the copper layer 23 with the coverlay 30 while a part of the copper layer 23 is exposed from the coverlay 30; a third step S30 of mechanically polishing at least an exposed part of the copper layer 23; and fourth steps S40 to S60 of forming a plating layer 24 on the copper layer 23 by plating the exposed part of the copper layer 23. Angles αand αbetween a polishing direction of the exposed part of the copper layer 23 and bending lines Cand Cin the third step S30 meet the following expression (1): 30[°]≤α,α≤150[°]...(1)
Inventors:
INABA MASATOSHI
MIYATA YASUSHI
WATANABE HIROTO
MIYATA YASUSHI
WATANABE HIROTO
Application Number:
JP2014076694A
Publication Date:
September 04, 2014
Filing Date:
April 03, 2014
Export Citation:
Assignee:
FUJIKURA LTD
International Classes:
H05K3/26; B24B29/00; H05K1/02; H05K1/11; H05K3/28
Domestic Patent References:
| JP2010034541A | 2010-02-12 | |||
| JP2008208400A | 2008-09-11 | |||
| JP2005175343A | 2005-06-30 | |||
| JP2013084777A | 2013-05-09 |
Attorney, Agent or Firm:
It can exceed and is a patent business corporation.