Title:
PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2016032066
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a printed wiring board which can reduce ion migration between neighboring interconnections of a conductor wiring pattern which is formed between conductor pads.SOLUTION: A printed wiring board comprises a second insulation layer 26, a plurality of conductor pads 34, 34 formed on the second insulation layer 26, and a conductor wiring pattern 60 having a first conductor pattern 30 and a second conductor pattern 40, which are formed between the conductor pads 34, 34. The first conductor pattern 30 has a plurality of first interconnections 31, 31, .. and the second conductor pattern 40 has a plurality of second interconnections 41, 41, .. The first interconnections 31, 31, .. and the second interconnections 41, 41, .. are alternately arranged on the second insulation layer 26. The first interconnection 31 has a fist metal layer 33 provided at an interface with the second insulation layer 26, and the second interconnection 41 has a second metal layer 43 provided at an interface with the second insulation layer 26. The first metal layer 33 and the second metal layer 43 are composed of metals different from each other.SELECTED DRAWING: Figure 2
Inventors:
TAKAHASHI NOBUYA
Application Number:
JP2014154857A
Publication Date:
March 07, 2016
Filing Date:
July 30, 2014
Export Citation:
Assignee:
IBIDEN CO LTD
International Classes:
H05K1/02
Attorney, Agent or Firm:
Yusuke Hiraki
Sekiya Mitsuo
Ishikawa Takiharu
Yasuhiko Mima
Sekiya Mitsuo
Ishikawa Takiharu
Yasuhiko Mima