Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JPH04246883
Kind Code:
A
Abstract:

PURPOSE: To enable a printed wiring board to be lessened in shrinkage caused by the effect of tension induced at the manufacture of prepreg and warpage and torsion caused by shrinkage difference by a method wherein the printed wiring board is formed of printed wiring board material of triaxially woven glass cloth.

CONSTITUTION: Prepreg is manufactured with glass cloth 3 where strands 2 formed of bundled filaments are made to intersect each other at an angle of 60 degrees. Then, double-sided copper plated boards 0.6mm and 1.0mm in thickness are formed of the prepreg concerned. In succession, a printed wiring board is formed of the double-sided copper plate board.


Inventors:
Mitsui, Shinichi
Onuki, Hidefumi
Application Number:
JP1991000011823
Publication Date:
September 02, 1992
Filing Date:
February 01, 1991
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
NEC CORP
International Classes:
D03D25/00; H05K1/03; (IPC1-7): D03D25/00; H05K1/03