Title:
PRINTED-WIRING BOARD
Document Type and Number:
Japanese Patent JPH09172236
Kind Code:
A
Abstract:
To provide a printed wiring board having bonding performance excellent in heat resistance even in a thin substitution type Au plating layer.
A bonding printed-wiring board having copper foil or copper plating as an underneath layer on a resin or ceramic or various kinds of metals, further having Ni alloy plating, PD plating, Au plating as a surface layer to be a substitution type non-electrolytic plating is featured by providing porus substitution type non-electrolytic palladium layer in thickness of 0.03-1μm as for the underneath Pd of said Au plating.
Inventors:
SERIZAWA SEIICHI
IGAWA MASAHIRO
TAKASAKI TAKAHARU
IGAWA MASAHIRO
TAKASAKI TAKAHARU
Application Number:
JP34907595A
Publication Date:
June 30, 1997
Filing Date:
December 20, 1995
Export Citation:
Assignee:
SERIZAWA SEIICHI
International Classes:
H05K1/09; H05K3/18; (IPC1-7): H05K1/09; H05K3/18
Attorney, Agent or Firm:
Akicho Katsube