Title:
PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JPH09283934
Kind Code:
A
Abstract:
To avoid forming voids in a plating process when via-holes are formed.
Bottom-closed via-holes IVH(interstitial via-holes) 100 are composed of holes, ands 101, a panel plated layer 70 and an electrolytic plated layer 80. The holes are formed by drilling until reaching a sheet 10, using an NC drill. The opening of each hole, i.e., the land 101 is rounded like a circular arc and the inner diameter thereof gradually decreases toward the inner layer.
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Inventors:
SATO HIROMOTO
Application Number:
JP11316996A
Publication Date:
October 31, 1997
Filing Date:
April 10, 1996
Export Citation:
Assignee:
NIPPON CMK KK
International Classes:
B23B41/00; H05K1/02; H05K3/40; H05K3/46; H05K1/00; H05K3/00; (IPC1-7): H05K3/46; B23B41/00; H05K1/02; H05K3/40
Attorney, Agent or Firm:
松浦 孝
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