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Patent Searching and Data


Title:
PRINTED WIRING MOTHER BOARD, DIE FOR MANUFACTURING MOTHER BOARD, AND MANUFACTURING METHOD OF MOTHER BOARD
Document Type and Number:
Japanese Patent JP2001267700
Kind Code:
A
Abstract:

To provide a printed wiring mother board, easy to remove a fitted printed circuit board while a warpage is small after push-back process, a die for manufacturing the printed wiring mother board, and its method for manufacturing the printed wiring mother board.

A blanked printed circuit board 12 is fitted into the original hole in the printed wiring mother board 10. The printed wiring mother board 10 has a plurality of slits 16 at an ear part on the edge side. In this case the slits 16 are preferably provided on two opposite sides. The length of the slits 16 is preferably not less than two thirds of the ear part. Then, the printed wiring mother board 10 can be obtained by using a die 30 having a slit forming pin 44 when the slit 16 is formed concurrently with the punching of the printed circuit board 12.


Inventors:
IWAMOTO KATSUHIKO
Application Number:
JP2000073286A
Publication Date:
September 28, 2001
Filing Date:
March 16, 2000
Export Citation:
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Assignee:
TAIHEI DENSHI KOGYO KK
International Classes:
B21D28/00; B21D28/24; H05K1/02; H05K3/00; (IPC1-7): H05K1/02; H05K3/00
Attorney, Agent or Firm:
Noboru Ueno