Title:
PRINTHEAD, IMAGE FORMING APPARATUS, AND METHOD FOR MANUFACTURING PRINTHEAD
Document Type and Number:
Japanese Patent JP2010201748
Kind Code:
A
Abstract:
To suppress a warpage of a recording element chip which may be generated in mounting the recording element chip on a wiring board.
A light emitting chip array 61 includes a light emitting chip C equipped with two or more LEDs, a circuit board 62 wherein various wiring is formed, and an intermediate member 64. The intermediate member 64 consists of sheet-shaped metals and is prepared between the circuit board 62 and the light emitting chip C. The material used for the intermediate member 64 has a coefficient of thermal expansion which is larger than that of the board of the light emitting chip C and smaller than that of the member of the circuit board 62.
Inventors:
FUKUKAWA ATSUSHI
Application Number:
JP2009048838A
Publication Date:
September 16, 2010
Filing Date:
March 03, 2009
Export Citation:
Assignee:
FUJI XEROX CO LTD
International Classes:
B41J2/44; B41J2/45; B41J2/455; G03G15/04; H01L33/00; H01L33/48; H04N1/036
Attorney, Agent or Firm:
Jiro Kobe
Takeshi Senda
Takefusa Kubo
Takeshi Senda
Takefusa Kubo