Title:
PRINTING METHOD, METHOD OF MANUFACTURING CONDUCTIVE BASE MATERIAL HAVING PLURAL CONDUCTIVE WIRES FORMED THEREIN USING THE PRINTING METHOD, PRINTING DEVICE, AND CONDUCTIVE BASE MATERIAL
Document Type and Number:
Japanese Patent JP2014130955
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a printing device capable of printing patterns on one surface side and the other surface side of a base material with high alignment accuracy.SOLUTION: A printing device 10 includes: a feeding mechanism 12; a first molded plate 15; a second molded plate 17; and filling mechanisms 21, 22. In the printing device 10, the feeding mechanism 12 feeds a laminate including a base material 30, a first resin layer 31 and a second resin layer 32. The molded plates 15, 17 have projections 15a, 17a which press the resin layers 31, 32. Recesses 31a, 32a formed in the resin layers 31, 32 are filled with an ink 35 by the filling mechanisms 21, 22.
Inventors:
OGAWA KENICHI
Application Number:
JP2012288740A
Publication Date:
July 10, 2014
Filing Date:
December 28, 2012
Export Citation:
Assignee:
DAINIPPON PRINTING CO LTD
International Classes:
H05K3/10; H01H11/00
Domestic Patent References:
| JP2002076581A | 2002-03-15 | |||
| JP2012216782A | 2012-11-08 | |||
| JP2006156930A | 2006-06-15 | |||
| JP2010137358A | 2010-06-24 | |||
| JP2012061832A | 2012-03-29 |
Foreign References:
| WO2012053625A1 | 2012-04-26 |
Attorney, Agent or Firm:
Hirohito Katsunuma
Hiroyuki Nagai
Katsuomi Isogai
Yukihiro Hotta
Kazuo Okamura
Hiroyuki Nagai
Katsuomi Isogai
Yukihiro Hotta
Kazuo Okamura