Title:
PROBE ALIGNING PLATE, PROBE APPLYING DEVICE, AND PROBE POSITION SENSING METHOD
Document Type and Number:
Japanese Patent JPH07218535
Kind Code:
A
Abstract:
PURPOSE: To quickly determine the position of a measuring probe of a semiconductor device.
CONSTITUTION: A conductiveness checking circuit 16a is equipped with a voltage source 20a and an ammeter 21a connected in series thereto, and these are inserted between one of the probes 14 and the conductive region 6. The tip 14a of each probe 14 is contacted with a contact plate 4, and their electricity continuing condition is to be examined. If the probe tip 14a is in contact with the conductive region 6, the ammeter 21a indicates an electric continuity, and if the tip is touching the insulative region 5, the meter 21a exhibits out of continuity. The position of the probe 14 is determined by referring to the position of the boundary line 22.
Inventors:
TSUJII TOSHIYUKI
Application Number:
JP1106994A
Publication Date:
August 18, 1995
Filing Date:
February 02, 1994
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
G01R1/06; G01R1/073; G01R31/28; H01L21/66; G01R31/26; (IPC1-7): G01R1/06; G01R1/073; G01R31/26; G01R31/28; H01L21/66
Attorney, Agent or Firm:
Takada Mamoru
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