Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
PROBE CARD AND ITS MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2008175656
Kind Code:
A
Abstract:

To provide a probe card which does not require a high degree of skillful technique, improves the productively, and can remarkably increase position accuracy of a probe needle, along with improving the productivity, and to provide its manufacturing method.

The manufacturing method comprises: the process of dripping an ultraviolet curing resin for putting a probe needle 1 at a required position of a ceramic ring 2 on which an epoxy resin 3 is applied to fill up and is hardened, and dripping an ultraviolet curing resin 5; the ultraviolet irradiation process of irradiating a spot where the curing resin 5 is dripped with ultraviolet rays in a state of being held with a manipulator 4; the process of circumferentially-providing swollen-out part for circumferentially providing a swollen-out part 8 in such a way as to wrap the probe needle 1 in; the heating process for heating and hardening the epoxy resin 3; the substrate adhesion process of adhering the ceramic ring 2 onto a probe card substrate 9; and the component-mounting and wiring process of mounting a designated component on the substrate and performing wiring work as well.


Inventors:
TAKATSUKA KENJI
TAMAKI KYOHEI
YOSHII SHIGETO
KOJIMA MASATAKA
Application Number:
JP2007008602A
Publication Date:
July 31, 2008
Filing Date:
January 18, 2007
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
GH TECHNOLOGY KK
International Classes:
G01R1/073; H01L21/66
Attorney, Agent or Firm:
Real name Akira