PURPOSE: To dispose electrodes in a high density and to easily position them from above by providing a wiring pattern made of split transparent conductive materials on the rear surface of a light transmission substrate, attaching the contact electrodes closed at wide openings at the ends to opposed pattern end, and surrounding them with an insulating member.

CONSTITUTION: Many flip-flop type semiconductor chips 21 are formed in a matrix shape on a wafer 20 to be measured, and two bumps 21a are projected on the chips 21. Then, contact electrodes 34 provided on the lower surface of a probe card 30 are contacted with the bumps 21a to be tested for the characteristics of the chips 21. At this time, the card 30 is formed as below. Split transparent wiring patterns 32 made of ITO are formed on the lower surface of a substrate 31 made of glass, tapered electrodes 34 closed at the pattern 32 and opened toward an exterior are secured to the opposed ends, and surrounded by light transmission resin 33, such as polyimide.