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Patent Searching and Data


Title:
PROBE CHIP
Document Type and Number:
Japanese Patent JPH03129500
Kind Code:
A
Abstract:

PURPOSE: To use a probe chip even in a narrow lead interval by providing an insulated main body equipped with a recessed part, which can be engaged with the lead of an electric element, and a conductor to be housed in the insulated main body and revealed from the insulated main body in the recessed part.

CONSTITUTION: A flexible main body 12 of an insulated material such as plastic, etc., is provided and a conductor 14 is fitted into this flexible main body 12. On the faced side surface, the flexible main body 12 is equipped with one recessed part at least and the conductor 14 is revealed in the other recessed part. Such a probe chip 10 is inserted and positioned between the leads of a package as being shown in A. Since there is no revealed metal so as to simultaneously get contact with the two adjacent leads, there is no danger that the adjacent leads are carelessly short-circuited. Thus, the probe chip can be used even in the narrow lead interval.


Inventors:
WAREN RII CHISUMU
Application Number:
JP26370190A
Publication Date:
June 03, 1991
Filing Date:
October 01, 1990
Export Citation:
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Assignee:
SONY TEKTRONIX CORP
International Classes:
G08C19/00; G01R1/067; H01R11/18; (IPC1-7): G08C19/00
Domestic Patent References:
JPS58172874U1983-11-18
JPS63159768U1988-10-19
Attorney, Agent or Firm:
Toshiaki Morisaki