To provide a probe pin and a probe pin seat, which cope with narrowing of electrode pitches in an IC package without thinning the plate thickness of a metal plate when manufactured by etching process.
The probe pin 100 is manufactured from the metal plate with thickness T by etching process, and contacts the electrode section of a device to be inspected. The pin 100 includes: contact points 101A, 101B contacting the electrode section, distal ends 103A, 103B formed along the plate surface of the metal plate; a slit forming section 105 that forms a slit SL1 containing a narrow width section NAR with a slit width Ws narrower than the contact point width Wcp between contact points 101A, 101B, in the space between the distal ends 103A, 103B, and connects to the distal ends 103A, 103B; and a forming section for an etching solution receiving region that forms an etching solution receiving region R1 with a receiving width Wr wider than the slit width Ws, and continues to the slit forming section 105.
| JPH10111314A | 1998-04-28 | |||
| JPH09219267A | 1997-08-19 |
Hidekazu Miyoshi
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu
Suzuki Isobe
Koichiro Takahisa