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Patent Searching and Data


Title:
PROBE SUPPORTING MECHANISM FOR MEASURING SURFACE SHAPE
Document Type and Number:
Japanese Patent JPH02297001
Kind Code:
A
Abstract:
PURPOSE:To easily manufacture this mechanism and to execute a measurement with high resolution by providing integrally a probe consisting of W or Fe on the tip part of a plate spring consisting of a thin film of SiO2 or Si3O4, and providing a step difference part on the plate spring. CONSTITUTION:A plate spring step difference part 15 is formed on an Si (100) substrate by using a prescribed mask. As for etching, a KOH solution is used, and after eliminating the mask, SiO2 which becomes a plate spring 12 is allowed to adhere to the whole surface of the substrate by a spatter method. A film characteristic is set so that a film stress of SiO2 shows a value being near zero or a tensile stress a little. The spring 12 is worked by Ar ion beam etching by using a photoresist mask pattern. By forming a probe 11 by ion beam etching, a needle shape having a steep tip part can be formed. Thereafter, an unnecessary Si layer is eliminated and an SiO2 plate spring supporting body 13 with a probe is formed. Since the probe 11 can be maintained horizontally against the measuring surface 14 without inclining the supporting body 13, impact force is absorbed by the step difference part 15, and the probe 11 and the measuring surface are scarcely damaged.

Inventors:
YANAGISAWA KEIICHI
FUNAKOSHI NORIHIRO
Application Number:
JP11724089A
Publication Date:
December 07, 1990
Filing Date:
May 12, 1989
Export Citation:
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Assignee:
NIPPON TELEGR & TELEPH CORP
International Classes:
G01B7/34; G01Q60/16; G01Q60/38; G01Q70/10; G11B5/84; H01J37/28; (IPC1-7): G01B7/34; G11B5/84; H01J37/28