PROBE UNIT FOR TESTING INTEGRATED CIRCUIT AND METHOD OF PRODUCING SAME

Title:

PROBE UNIT FOR TESTING INTEGRATED CIRCUIT AND METHOD OF PRODUCING SAME

Document Type and Number:

Japanese Patent JPS5989430

Kind Code:

A

Abstract:

A plurality of probes for contacting the pads of an integrated circuit are cantilevered within the aperture of a ceramic ring. The probes are fixed to the ring with an adhesive and a second ceramic ring is positioned on them to support them against contact forces. The probes are soldered to conductive tracks on the first ring for connection to test apparatus, providing a very rigid and dimensionally accurate and stable probe arrangement. The device can be constructed with the probes in contact with a sample integrated circuit, in a quick and simple process.

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Inventors:

ORIBAA ROBAATO GIYARETSUTOSON
GOODON UIRIAMU WATOSON

Application Number:

JP17205383A

Publication Date:

May 23, 1984

Filing Date:

September 17, 1983

Export Citation:

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Assignee:

ANGURIATEKU LTD

International Classes:

H01L21/66; G01R1/073; (IPC1-7): H01L21/66

Attorney, Agent or Firm:

Aoyama Aoi

Previous Patent: A lighting installation and the headlight for vehicles

Next Patent: JPS5989431