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Title:
PROBER DEVICE AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2003121494
Kind Code:
A
Abstract:

To carry out measurement without bringing a probe needle not used for the measurement or a probe needle to be set open into contact with a measuring pad.

Part of a probe needle 1 is machined into a fan-like shape and the part 1a machined into the fan-like shape is pressed by an electromagnet 3 and released, so that the probe needle 1 is extended and constricted, and contact and non-contact of the probe needle 1 with respect to the measuring pad 4 is executed.


Inventors:
KANAO TAKASHI
KOMORI JUNKO
Application Number:
JP2001321338A
Publication Date:
April 23, 2003
Filing Date:
October 19, 2001
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP
RYODEN SEMICONDUCTOR SYST ENG
International Classes:
G01R31/26; G01R1/06; G01R1/067; H01L21/66; (IPC1-7): G01R31/26; G01R1/06; G01R1/067; H01L21/66
Attorney, Agent or Firm:
Keigo Murakami (3 outside)



 
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