PURPOSE: To accurately connect a needle tip of a probe needle to an electrode pad of a semiconductor device irrespective of a size of a measuring region.

CONSTITUTION: A probe card 3 provided with a probe needle 2 is fixed to a card holder 7 composed of a metal such as ring-like aluminum, stainless or the like which is a size larger than the probe card 3 with a screw. The upper surface of this card holder 7 is formed as the flat reference plane S1 processed with high precision and a height of a needle tip of the probe needle 2 is aligned to this reference plane S1, and in such a condition that the reference plane S2 on the side of an inserting ring 6 parallel to the holding plane of a wafer holding pedestal 1 is connected to the reference plane S1, the card holder 7 is mounted to the inserting ring.