システム・イン・パッケージ技術に基づくプロセス設計方法、システム、媒体及びデバイス

Japanese Patent JP7284962

B2

The present invention provides a system-in-package technology-based process design method and system, a medium and a device. The system-in-package technology-based process design method comprises: acquiring design data of a layout and three-dimensional model data associated with the layout; associating and matching the design data with the three-dimensional model data according to design element attribute information in the design data, and assembling the design data and the three-dimensional model data into an integrated packaging model; and performing assembly process analysis on the integrated packaging model to analyze unreasonable design points used as design modifications and references; or directly exporting, from the integrated packaging model, a packaging process manufacturing procedure for production and manufacturing. By means of the present invention, a lot of repetitive work can be removed, and manual work can be replaced by automation, thereby saving 60%-80% of the time compared with the original method; in addition, the working difficulty is reduced, and the process from design to simulation and production and manufacturing is simplified, greatly improving the competitiveness of electronic products.

▲銭▼ ▲勝▼杰
武 ▲紀▼宏
▲劉▼ ▲継▼▲碩▼
▲劉▼ ▲豊▼收

JP2021568681A

June 01, 2023

April 22, 2020

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Shanghai Wuyou Information Technology Co., Ltd.

G06F30/398; H01L25/04; H01L25/18

JP2005339464A
JP60025256A
JP2007286891A

CN106777756A
US20080250182
CN102073775A
CN109241681A

Suguru Ito

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