PROCESS OF FABRICATING SLIP RING COMPONENT

Title:

PROCESS OF FABRICATING SLIP RING COMPONENT

Document Type and Number:

Japanese Patent JP2012227139

Kind Code:

A

Abstract:

To provide a process of fabricating a slip ring which does not involve expensive materials or is not labor-intensive in fabrication.

A process of fabricating a slip ring component (106), the slip ring component and a slip ring assembly are disclosed. The process of fabricating the slip ring component includes forming a first shot (404), forming a second shot (402), and immersion bathing the first shot (404) and the second shot (402). The immersion bathing applies an electrically conductive plating to exposed surfaces of the second shot (402).

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Inventors:

LENKER WILLIAM GARY
GREGORY GORDON GRIFFITH
EDWARD JOHN HOWARD

Application Number:

JP2012088008A

Publication Date:

November 15, 2012

Filing Date:

April 09, 2012

Export Citation:

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Assignee:

TYCO ELECTRONICS CORP

International Classes:

H01R43/10; C25D7/00; H01R39/00

Attorney, Agent or Firm:

Tyco Electronics Corporation

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