Title:
マテリアルハンドリング施設におけるプロセス管理のシステムおよび方法
Document Type and Number:
Japanese Patent JP5770839
Kind Code:
B2
Abstract:
Various embodiments of a system and method for process management in a materials handling facility are described. Embodiments may include a process control component configured to generate a model of multiple unit handling processes of a materials handling facility. For each process, the model may indicate a measured throughput rate. The process control component may be configured to, based on at least one target output rate that is a goal for the output rate of a given unit handling process, evaluate the model to generate a particular target throughput rate that is a goal for the respective throughput rate of a particular unit handling process that is performed prior to the given unit handling process. The process control component may be configured to, based on the particular target throughput rate, generate one or more instructions to control the respective throughput rate of units processed by the particular unit handling process.
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Inventors:
Yusuke Hara
Alya, Joseph, M
Won, cherry, jii
Nguyen, Natalie, Tee
Lottera, christopher, david
Dean, Aalen, Earl
Alya, Joseph, M
Won, cherry, jii
Nguyen, Natalie, Tee
Lottera, christopher, david
Dean, Aalen, Earl
Application Number:
JP2013512225A
Publication Date:
August 26, 2015
Filing Date:
May 25, 2011
Export Citation:
Assignee:
Amazon Technologies, Inc.
International Classes:
G06Q10/08; B65G1/137
Domestic Patent References:
| JP8192906A | ||||
| JP2007018505A | ||||
| JP2007272652A | ||||
| JP5192852A |
Attorney, Agent or Firm:
Masaki Yamakawa
Shigeki Yamakawa
Shigeki Yamakawa
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